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Semiconductors & Electronics
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Die & Packaging Inspection
High-resolution optical microscopy and cross-section analysis of die attach, mold compound integrity, underfill voids, delamination, and package cracking in QFN, BGA, CSP, SiP, and advanced 2.5D/3D packages.
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Metallization & Interconnects
Layer thickness, uniformity, and defect evaluation of Al, Cu, Ti, Ta, W, barrier layers, and RDL — including electromigration sites, voiding, hillocks, and interface reactions using precision polishing and microscopy.
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Bonding Interfaces Analysis
Wire bonding (Au, Cu, Ag), flip-chip bumping (C4, Cu pillar), TSV, and hybrid bonding inspection — bond strength correlation, intermetallic compound growth, Kirkendall voids, and lift/crater failure mechanisms.
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Contamination & Purity Testing
Identification and localization of ionic, organic, particulate, and metallic contaminants on wafer surfaces, bonding pads, packages, and assembly lines — root cause determination for corrosion, leakage, and yield loss.
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Semiconductor Failure Analysis
Comprehensive root-cause investigation of ESD/EOS damage, latch-up, TDDB, HCI, gate oxide breakdown, metal migration, package-level moisture sensitivity, and early-life failures — combining microscopy, cross-sectioning, and electrical fault isolation insights.
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Industry Standards & Protocols
Analysis compliant with JEDEC, AEC-Q100, MIL-STD-883, IPC, ASTM, and customer-specific qualification requirements — detailed FA reports with high-magnification imaging, measurements, and actionable recommendations.
Solving Semiconductor Challenges
Partner with G-Hexa for fast, accurate, and confidential materials & failure analysis services that help semiconductor and electronics manufacturers improve yield, reliability, and time-to-market.