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| Parameter | Specification |
|---|---|
| Model | GHX-GRP-CON-GRD-DIA-011 |
| Plate Diameter | 200 mm / 250 mm / 300 mm |
| Magnetic Strength | High-performance neodymium magnets – firm hold for all conversion plates |
| Surface Flatness | < 0.01 mm (precision ground) |
| Material | High-grade steel core with corrosion-resistant coating |
| Attachment Method | Direct mount to grinder/polisher chassis (replaces standard platen) |
| Compatibility | All G-Hexa AD-PSA, AD-PB, AD-Foil conversion plates; standard magnetic platen systems |
| Thickness | Standard metallographic platen thickness (~10–12 mm) |
| Max Operating Speed | Up to 1200 rpm (balanced & vibration-free) |
| Operating Temperature | Up to 80 °C (wet grinding) |
| Cleaning Method | Wipe with damp cloth or rinse with water |
| Order Numbers | 04.08.010 (200 mm), 04.08.020 (250 mm), 04.08.030 (300 mm) |
| Package | 1 pc |
| Parameter | Specification |
|---|---|
| Model | GHX-GRP-CON-GRD-DIA-010 |
| Plate Diameter | 200 mm / 250 mm / 300 mm |
| Surface Type | Proprietary plain-back transfer layer |
| Consumable Compatibility | All plain-back (non-PSA) SiC papers, diamond grinding foils, diamond films, and similar non-adhesive abrasives |
| Mounting Method | Magnetic (if supported) or standard clamp to grinder platen |
| Material | Precision-machined aluminum alloy with durable transfer coating |
| Thickness | Standard metallographic platen thickness (~8–12 mm) |
| Reusability | Hundreds to thousands of cycles (water rinse to refresh) |
| Cleaning Method | Rinse with water only — no scraping or solvents required |
| Operating Temperature | Up to 80 °C (wet grinding) |
| Order Numbers | 04.08.310 (200 mm), 04.08.320 (250 mm), 04.08.330 (300 mm) |
| Package | 1 pc |
| Parameter | Specification |
|---|---|
| Model | GHX-GRP-CON-GRD-DIA-009 |
| Plate Diameter | 200 mm / 250 mm / 300 mm |
| Surface Type | Proprietary foil-optimized transfer layer |
| Adhesive Residue | None – clean water rinse removal |
| Compatible Consumables | All self-adhesive (PSA) foil-based SiC papers, diamond grinding foils, ultra-thin diamond films |
| Mounting Method | Magnetic (if supported) or standard clamp to grinder platen |
| Material | Precision-machined aluminum alloy with durable transfer coating |
| Thickness | Standard metallographic platen thickness (~8–12 mm) |
| Reusability | Hundreds to thousands of cycles (water rinse to refresh surface) |
| Cleaning Method | Rinse with water (no solvents or scraping required) |
| Operating Temperature | Up to 80 °C (wet grinding) |
| Order Numbers | 04.08.422 (200 mm), 04.08.430 (250 mm), 04.08.432 (300 mm) |
| Package | 1 pc |
| Parameter | Specification |
|---|---|
| Model | GHX-GRP-CON-GRD-DIA-008 |
| Plate Diameter | 200 mm / 250 mm / 300 mm |
| Surface Type | Specialized high-performance PSA layer |
| Adhesive Residue | None – clean peel-off design |
| Compatibility | All PSA-backed abrasive discs, diamond films, polishing cloths |
| Mounting Method | Magnetic or direct clamp (depending on grinder model) |
| Material | Precision-machined aluminum alloy core with durable PSA coating |
| Thickness | Standard metallographic platen thickness (typically 8–12 mm) |
| Reusability | Hundreds to thousands of cycles (depending on usage & cleaning) |
| Cleaning Method | Wipe with IPA or mild solvent if needed; no scraping required |
| Operating Temperature | Up to 80 °C (wet grinding) |
| Order Numbers | 04.08.410 (200 mm), 04.08.413 (250 mm), 04.08.420 (300 mm) |
| Package | 1 pc |
| Micron Size | 8 inch (200 mm) Order No. | 10 inch (250 mm) Order No. | 12 inch (300 mm) Order No. | Package Quantity | Bond Type | Recommended Use Stage | Typical Surface Finish |
|---|---|---|---|---|---|---|---|
| 1 µm | 14.01.461-3 | 14.01.475-1 | 14.01.484-1 | 5 pcs | Resin | Final fine grinding / pre-polish | Near-mirror, Ra < 10 nm |
| 3 µm | 14.01.462-1 | 14.01.476-1 | 14.01.485-1 | 5 pcs | Resin | Fine grinding / intermediate polish | Very fine, low damage |
| 6 µm | 14.01.463-1 | 14.01.478-1 | 14.01.486-1 | 5 pcs | Resin | Medium-fine grinding | Smooth, controlled removal |
| 9 µm | 14.01.464-1 | 14.01.477-1 | 14.01.483-1 | 5 pcs | Resin | Medium grinding | Good flatness, minimal scratches |
| 15 µm | 14.01.465-1 | 14.01.479-1 | 14.01.487-1 | 5 pcs | Resin | Intermediate grinding | Fast stock removal, flat |
| 30 µm | 14.01.466-1 | 14.01.481-1 | 14.01.488-1 | 5 pcs | Resin | Rough grinding / plane preparation | Aggressive, uniform plane |
| FEPA Grit | 8 inch (200 mm) Order No. | 10 inch (250 mm) Order No. | 12 inch (300 mm) Order No. | Package | Bond Type | Key Characteristics |
|---|---|---|---|---|---|---|
| 80 | 04.02.110S | 04.02.210S | 04.02.310S | 1 pc | Resin | Very aggressive plane grinding |
| 120 | 04.02.120S | 04.02.220S | 04.02.320S | 1 pc | Resin | Fast plane & fine grinding |
| 200 | 04.02.125S | 04.02.225S | 04.02.325S | 1 pc | Resin | Strong fine grinding stage |
| 400 | 04.02.130S | 04.02.230S | 04.02.330S | 1 pc | Resin | Fine grinding – excellent flatness |
| 800 | 04.02.140S | 04.02.240S | 04.02.340S | 1 pc | Resin | Very fine grinding / pre-polishing |
| 1500 | 04.02.150S | 04.02.250S | 04.02.350S | 1 pc | Resin | Ultra-fine grinding – near polishing quality |
| 3000 | 04.02.160S | 04.02.260S | 04.02.360S | 1 pc | Resin | Near-mirror finish, minimal damage |
| 5000 | 04.02.170S | 04.02.270S | 04.02.370S | 1 pc | Resin | Final grinding stage – mirror-prep ready |
| FEPA Grit | 8 inch (200 mm) Order No. | 10 inch (250 mm) Order No. | 12 inch (300 mm) Order No. | Package | Bond Type | Recommended Materials |
|---|---|---|---|---|---|---|
| 80 | 04.01.110S | 04.01.210S | 04.01.310S | 1 pc | Nickel | Very aggressive plane grinding – very hard materials |
| 120 | 04.01.120S | 04.01.220S | 04.01.320S | 1 pc | Nickel | Fast plane & fine grinding |
| 200 | 04.01.125S | 04.01.225S | 04.01.325S | 1 pc | Nickel | Strong fine grinding stage |
| 400 | 04.01.130S | 04.01.230S | 04.01.330S | 1 pc | Nickel | Fine grinding – excellent flatness |
| 800 | 04.01.140S | 04.01.240S | 04.01.340S | 1 pc | Nickel | Very fine grinding / pre-polishing |
| 1200 | 04.01.150S | 04.01.250S | 04.01.350S | 1 pc | Nickel | Ultra-fine grinding – near polishing quality |
| Grit (FEPA) | Type | 8" (200 mm) Order No. | 10" (250 mm) Order No. | 12" (300 mm) Order No. | Package Quantity | Backing Type | Key Characteristics |
|---|---|---|---|---|---|---|---|
| 60 | Plain Back | 03.01.101 | 03.01.401 | 03.01.701 | 50 pcs | Plain | Aggressive stock removal, initial plane grinding |
| 120 | Plain Back | 03.01.103 | 03.01.403 | 03.01.703 | 100 pcs | Plain | Fast cutting, good for roughing |
| 180 | Plain Back | 03.01.104 | 03.01.404 | 03.01.704 | 100 pcs | Plain | Balanced removal rate, reduced scratching |
| 240 | Plain Back | 03.01.104-1 | 03.01.404-1 | 03.01.704-1 | 100 pcs | Plain | Fine plane grinding |
| 320 | Plain Back | 03.01.105 | 03.01.405 | 03.03.705 | 100 pcs | Plain | Pre-fine grinding, improved flatness |
| 400 | Plain Back | 03.01.106 | 03.01.406 | 03.01.706 | 100 pcs | Plain | Fine grinding stage |
| 800 | Plain Back | 03.01.108 | 03.01.408 | 03.01.708 | 100 pcs | Plain | Pre-polish quality |
| 1200 | Plain Back | 03.01.110 | 03.01.410 | 03.01.710 | 100 pcs | Plain | Near-polish finish, low deformation |
| 60 | PSA | 03.02.401 | 03.02.500 | 03.02.801 | 50 pcs | PSA | Quick-stick, secure hold for coarse grinding |
| 120 | PSA | 03.02.403 | 03.02.503 | 03.02.803 | 100 pcs | PSA | Fast adhesion, no clamping rings |
| 180 | PSA | 03.02.404 | 03.02.504 | 03.02.804 | 100 pcs | PSA | Reliable wet performance |
| 240 | PSA | 03.02.404-1 | 03.02.504-1 | 03.02.804-1 | 100 pcs | PSA | Consistent fine grinding |
| 320 | PSA | 03.02.405 | 03.02.505 | 03.02.805 | 100 pcs | PSA | Excellent flatness |
| 400 | PSA | 03.02.406 | 03.02.506 | 03.02.806 | 100 pcs | PSA | Fine surface prep |
| 800 | PSA | 03.02.408 | 03.02.508 | 03.02.808 | 100 pcs | PSA | High edge retention |
| 1200 | PSA | 03.02.410 | 03.02.510 | 03.02.810 | 100 pcs | PSA | Mirror-prep stage |
| Grit (FEPA) | Type | 8" (200 mm) Order No. | 10" (250 mm) Order No. | 12" (300 mm) Order No. | Package Quantity | Backing Type | Key Features |
|---|---|---|---|---|---|---|---|
| 120 | Plain Back | 03.03.103 | 03.03.403 | 03.03.703 | 50 pcs | Plain | Aggressive removal, initial plane grinding |
| 180 | Plain Back | 03.03.104 | 03.03.404 | 03.03.704 | 100 pcs | Plain | Fast stock removal, good for roughing |
| 400 | Plain Back | 03.03.107 | 03.03.407 | 03.03.707 | 100 pcs | Plain | Fine grinding, reduced scratching |
| 800 | Plain Back | 03.03.109 | 03.03.409 | 03.03.709 | 100 pcs | Plain | Pre-polish stage, improved flatness |
| 1200 | Plain Back | 03.03.111 | 03.03.411 | 03.03.711 | 100 pcs | Plain | Near-polish finish, low deformation |
| 2000 | Plain Back | 03.03.113 | 03.03.413 | 03.03.713 | 100 pcs | Plain | Ultra-fine grinding |
| 2500 | Plain Back | 03.03.114 | 03.03.414 | 03.03.714 | 100 pcs | Plain | High surface quality |
| 2400 | Plain Back | 03.03.115 | 03.03.415 | 03.03.715 | 100 pcs | Plain | Mirror-prep stage |
| 4000 | Plain Back | 03.03.116 | 03.03.416 | 03.03.716 | 100 pcs | Plain | Final grinding, minimal subsurface damage |
| 120 | PSA | 03.04.203 | 03.04.503 | 03.04.803 | 50 pcs | PSA (self-adhesive) | Quick-stick application, no clamping rings |
| 180 | PSA | 03.04.204 | 03.04.504 | 03.04.804 | 100 pcs | PSA | Fast adhesion, secure hold |
| 400 | PSA | 03.04.207 | 03.04.507 | 03.04.807 | 100 pcs | PSA | Easy changeover, consistent flatness |
| 800 | PSA | 03.04.209 | 03.04.509 | 03.04.809 | 100 pcs | PSA | Reliable bonding during wet use |
| 1200 | PSA | 03.04.211 | 03.04.511 | 03.04.811 | 100 pcs | PSA | High edge retention |
| 2000 | PSA | 03.04.213 | 03.04.513 | 03.04.813 | 100 pcs | PSA | Fine surface prep |
| 2500 | PSA | 03.04.214 | 03.04.514 | 03.04.814 | 100 pcs | PSA | Excellent for delicate materials |
| 2400 | PSA | 03.04.215 | 03.04.515 | 03.04.815 | 100 pcs | PSA | Near-mirror finish |
| 4000 | PSA | 03.04.216 | 03.04.516 | 03.04.816 | 100 pcs | PSA | Ultra-fine grinding |
| Disc Type | Recommended Hardness Range | Recommended Diamond Suspension | Key Advantages | Available Diameters | Package Format |
|---|---|---|---|---|---|
| POS | < 150 HV to 450 HV | 9 μm – 3 μm diamond suspension or spray | Medium to low hardness; softer/composite materials; high flatness; reduced steps | 200 mm, 250 mm, 300 mm, 350 mm | Sold individually or in sets (contact for bulk) |
| POH | > 150 HV (medium to high) | 15 μm – 6 μm diamond suspension or spray | Higher hardness materials; exceptional removal rate; long service life; superior reproducibility | 200 mm, 250 mm, 300 mm, 350 mm | Sold individually or in sets (contact for bulk) |
| Common Features | Both types offer: higher grinding efficiency vs. SiC paper, lower elasticity for better flatness, reduced grinding steps, lower consumable consumption, eco-friendly process | — | Consistent high removal rate, minimal media changes, high experimental reproducibility | 200 mm, 250 mm, 300 mm, 350 mm | — |
| Parameter | Details (Standard - TJ 2400) | Details (Low-Viscosity - TJ 2404) |
|---|---|---|
| Model | GHEXA-MNT-CON-ACR-016 | GHEXA-MNT-CON-ACR-016 |
| Material Type | UV-Curing Acrylic Resin (Single-Component) | UV-Curing Acrylic Resin (Single-Component) |
| Curing Method | Low-energy UV light | Low-energy UV light |
| Curing Time | 30-60 seconds | Approximately 2 minutes |
| Exotherm / Heat Release | Very low | Very low |
| Viscosity | Medium | Low (enhanced flowability) |
| Appearance after Cure | High transparency / crystal clear | High transparency / crystal clear |
| Hardness (Shore D, typical) | ~78-82 | ~78-82 |
| Shrinkage Rate | Low | Low |
| Additional Features | Fastest curing for rapid batch prep; minimal heat generation | Superior flow and penetration; ideal for complex shapes or vacuum assist |
| Package Size | 1 kg | 1 kg |
| Parameter | Details |
|---|---|
| Model | GHEXA-MNT-CON-EPO-015 |
| Material Type | Conductive Epoxy Resin (Cold Mounting) |
| Components | Part A: Conductive Epoxy Resin (Liquid), Part B: Hardener (Liquid) |
| Mixing Ratio (A:B w/w) | 2:1 |
| Mixing Time | 5-10 minutes |
| Curing Time (at 25°C) | 2-3 hours |
| Peak Exotherm Temperature | 90°C |
| Hardness (Shore D) | 82 |
| Appearance | Colorless and transparent (with conductive properties) |
| Edge Retention | Excellent |
| Shrinkage Rate | Very low |
| Additional Features | Electrically conductive for SEM/EDS use; superior flowability, strong adhesion, high chemical resistance; eliminates need for carbon/gold coating on non-conductive samples; suitable for vacuum impregnation |
| Parameter | Details |
|---|---|
| Model | GHEXA-MNT-CON-EPO-014 |
| Material Type | Epoxy Resin (Cold Mounting) |
| Components | Part A: Epoxy Resin (Liquid), Part B: Hardener (Liquid) |
| Mixing Ratio (A:B w/w) | 2:1 |
| Mixing Time | 10-20 minutes |
| Curing Time (at 25°C) | 8-12 hours |
| Peak Exotherm Temperature | 40°C |
| Hardness (Shore D) | 80 |
| Appearance | Colorless and transparent |
| Edge Retention | Better |
| Shrinkage Rate | Very low |
| Additional Features | Excellent flowability, superior adhesion, high chemical resistance and stability; low exotherm for heat-sensitive samples; versatile for both routine and precision mounting |
| Parameter | Details |
|---|---|
| Model | GHEXA-MNT-CON-EPO-013 |
| Material Type | Low-Viscosity Epoxy Resin (Cold Mounting) |
| Components | Part A: Epoxy Resin (Liquid), Part B: Hardener (Liquid) |
| Mixing Ratio (A:B w/w) | 3:1 |
| Pot Life | 30-60 minutes |
| Mixing Time | 3-5 minutes (recommended) |
| Cure Time (at 25°C) | 10-12 hours (full cure) |
| Peak Exotherm Temperature | <32°C |
| Hardness (Shore D) | 80 |
| Appearance | Colorless and transparent |
| Edge Protection | Better |
| Viscosity | Low (excellent flow and penetration) |
| Additional Features | Superior adhesion, very low shrinkage, high chemical resistance; ideal for vacuum impregnation and complex/porous samples |
| Parameter | Details |
|---|---|
| Model | GHEXA-MNT-CON-EPO-012 |
| Material Type | Epoxy Resin (Cold Mounting) |
| Components | Part A: Epoxy Resin (Liquid), Part B: Hardener (Liquid) |
| Mixing Ratio (A:B w/w) | 4.5:1 |
| Mixing Time | 5-10 minutes |
| Curing Time (at 25°C) | 45-90 minutes |
| Peak Exotherm Temperature | 125°C |
| Hardness (Shore D) | 82 |
| Appearance | Colorless and transparent |
| Edge Retention | Excellent |
| Shrinkage Rate | Very low |
| Additional Features | Superior flowability, strong adhesion, high chemical resistance and stability; suitable for vacuum impregnation when maximum clarity and void-free embedding are required |
| Parameter | Specification |
|---|---|
| Product Model | GHEXA-MNT-CON-EPO-011 |
| Material Type | Epoxy Resin Mounting Compound |
| System | Two-Part (Liquid Resin + Liquid Hardener) |
| Appearance | Colorless, transparent |
| Part A | Epoxy Resin, Liquid |
| Part B | Hardener, Liquid |
| Mixing Ratio (A:B, w/w) | 2 : 1 |
| Mixing Time | 5–10 minutes |
| Curing Time @ 25 °C | 1–2 hours |
| Peak Exothermic Temperature | 112 °C |
| Hardness | Shore D 78 |
| Edge Retention | Good |
| Flowability | Excellent |
| Shrinkage | Low |
| Adhesion | Strong |
| Chemical Stability | Superior |
| Mold Reference | Φ30 mm mold at 20–25 °C |
| Solvent Compatibility | Cured resin removable with Trojan DSV10 solvent |
| Parameter | Specification |
|---|---|
| Product Model | GHEXA-MNT-CON-EPO-010 |
| Material Type | Epoxy Resin Mounting Compound |
| System | Two-Part (Liquid Resin + Liquid Hardener) |
| Appearance | Colorless transparent to light yellow |
| Part A | Epoxy Resin, Liquid |
| Part B | Hardener, Liquid |
| Mixing Ratio (A:B, w/w) | 2 : 1 |
| Mixing Time | 4–8 minutes |
| Curing Time @ 25 °C | 30–60 minutes |
| Peak Exothermic Temperature | 144 °C |
| Hardness | Shore D 82 |
| Edge Retention | Better / Enhanced |
| Flowability | Excellent |
| Shrinkage | Low |
| Adhesion | Strong |
| Chemical Stability | Superior |
| Transparency | High |
| Parameter | Specification |
|---|---|
| Product Model | GHEXA-MNT-CON-ACR-009 |
| Material Type | Acrylic Resin Mounting Compound |
| System | Two-Part (Resin + Hardener) |
| Appearance | Semi-transparent |
| Part A | Resin, Powder (White) |
| Part B | Hardener, Liquid |
| Mixing Ratio (A:B, w/w) | 10 : 5 |
| Mixing Time | 2–4 minutes |
| Curing Time @ 25 °C | 8–10 minutes |
| Peak Exothermic Temperature | 85 °C |
| Hardness | Shore D 82 |
| Edge Retention | Better / Enhanced |
| Shrinkage Rate | Low |
| Permeability | Good |
| Recommended Process | Cold mounting press |
| Mold Reference | Φ30 mm mold at 20–25 °C |
| Solvent Compatibility | Can be dissolved with Trojan DSV10 solvent after curing |
| Parameter | Specification |
|---|---|
| Product Model | GHEXA-MNT-CON-ACR-008 |
| Material Type | Acrylic Resin Mounting Compound |
| System | Two-Part (Resin + Hardener) |
| Part A | Resin, Powder (White) |
| Part B | Hardener, Liquid |
| Mixing Ratio (A:B, w/w) | 10 : 8 |
| Mixing Time | 2–4 minutes |
| Curing Time @ 25 °C | 8–10 minutes |
| Peak Exothermic Temperature | 80 °C |
| Hardness | Shore D 80 |
| Transparency | High |
| Flowability | Excellent |
| Permeability | Excellent |
| Edge Protection | Good |
| Typical Use | Rapid embedding & mounting |
| Parameter | Value |
|---|---|
| Product Name | Epoxy Resin (10:1 Fast-Cure System) |
| Model | GHEXA-MNT-CON-EPO-007 |
| Type | Two-component epoxy (Resin A + Hardener B) |
| Mixing Ratio | 10:1 by volume (Resin : Hardener) |
| Curing Conditions | 5 minutes at 150°C |
| Curing Characteristic | Bubble-free cure; turns red upon full cure |
| Appearance (Uncured) | Clear to pale yellow liquid (Resin); clear liquid (Hardener) |
| Appearance (Cured) | Red solid |
| Chemical Resistance | Excellent – resists most chemical etchants after curing |
| Adhesion | Superior to metals, ceramics, glass, most plastics |
| Application Method | Brush, pipette, or dispensing needle |
| Primary Uses | Delicate specimen bonding, TEM stacking, pre-coating, PCB micro-hole filling |