Consumables

G-Hexa consumables are engineered to deliver consistency, precision, and repeatability across material preparation workflows. From sectioning to mounting and surface finishing, our consumable range supports metallography, materials testing, and advanced characterization by ensuring defect-free preparation and reliable analytical outcomes.
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Parameter Specification
Model GHX-GRP-CON-GRD-DIA-011
Plate Diameter 200 mm / 250 mm / 300 mm
Magnetic Strength High-performance neodymium magnets – firm hold for all conversion plates
Surface Flatness < 0.01 mm (precision ground)
Material High-grade steel core with corrosion-resistant coating
Attachment Method Direct mount to grinder/polisher chassis (replaces standard platen)
Compatibility All G-Hexa AD-PSA, AD-PB, AD-Foil conversion plates; standard magnetic platen systems
Thickness Standard metallographic platen thickness (~10–12 mm)
Max Operating Speed Up to 1200 rpm (balanced & vibration-free)
Operating Temperature Up to 80 °C (wet grinding)
Cleaning Method Wipe with damp cloth or rinse with water
Order Numbers 04.08.010 (200 mm), 04.08.020 (250 mm), 04.08.030 (300 mm)
Package 1 pc
Parameter Specification
Model GHX-GRP-CON-GRD-DIA-010
Plate Diameter 200 mm / 250 mm / 300 mm
Surface Type Proprietary plain-back transfer layer
Consumable Compatibility All plain-back (non-PSA) SiC papers, diamond grinding foils, diamond films, and similar non-adhesive abrasives
Mounting Method Magnetic (if supported) or standard clamp to grinder platen
Material Precision-machined aluminum alloy with durable transfer coating
Thickness Standard metallographic platen thickness (~8–12 mm)
Reusability Hundreds to thousands of cycles (water rinse to refresh)
Cleaning Method Rinse with water only — no scraping or solvents required
Operating Temperature Up to 80 °C (wet grinding)
Order Numbers 04.08.310 (200 mm), 04.08.320 (250 mm), 04.08.330 (300 mm)
Package 1 pc
Parameter Specification
Model GHX-GRP-CON-GRD-DIA-009
Plate Diameter 200 mm / 250 mm / 300 mm
Surface Type Proprietary foil-optimized transfer layer
Adhesive Residue None – clean water rinse removal
Compatible Consumables All self-adhesive (PSA) foil-based SiC papers, diamond grinding foils, ultra-thin diamond films
Mounting Method Magnetic (if supported) or standard clamp to grinder platen
Material Precision-machined aluminum alloy with durable transfer coating
Thickness Standard metallographic platen thickness (~8–12 mm)
Reusability Hundreds to thousands of cycles (water rinse to refresh surface)
Cleaning Method Rinse with water (no solvents or scraping required)
Operating Temperature Up to 80 °C (wet grinding)
Order Numbers 04.08.422 (200 mm), 04.08.430 (250 mm), 04.08.432 (300 mm)
Package 1 pc
Parameter Specification
Model GHX-GRP-CON-GRD-DIA-008
Plate Diameter 200 mm / 250 mm / 300 mm
Surface Type Specialized high-performance PSA layer
Adhesive Residue None – clean peel-off design
Compatibility All PSA-backed abrasive discs, diamond films, polishing cloths
Mounting Method Magnetic or direct clamp (depending on grinder model)
Material Precision-machined aluminum alloy core with durable PSA coating
Thickness Standard metallographic platen thickness (typically 8–12 mm)
Reusability Hundreds to thousands of cycles (depending on usage & cleaning)
Cleaning Method Wipe with IPA or mild solvent if needed; no scraping required
Operating Temperature Up to 80 °C (wet grinding)
Order Numbers 04.08.410 (200 mm), 04.08.413 (250 mm), 04.08.420 (300 mm)
Package 1 pc
Micron Size 8 inch (200 mm) Order No. 10 inch (250 mm) Order No. 12 inch (300 mm) Order No. Package Quantity Bond Type Recommended Use Stage Typical Surface Finish
1 µm 14.01.461-3 14.01.475-1 14.01.484-1 5 pcs Resin Final fine grinding / pre-polish Near-mirror, Ra < 10 nm
3 µm 14.01.462-1 14.01.476-1 14.01.485-1 5 pcs Resin Fine grinding / intermediate polish Very fine, low damage
6 µm 14.01.463-1 14.01.478-1 14.01.486-1 5 pcs Resin Medium-fine grinding Smooth, controlled removal
9 µm 14.01.464-1 14.01.477-1 14.01.483-1 5 pcs Resin Medium grinding Good flatness, minimal scratches
15 µm 14.01.465-1 14.01.479-1 14.01.487-1 5 pcs Resin Intermediate grinding Fast stock removal, flat
30 µm 14.01.466-1 14.01.481-1 14.01.488-1 5 pcs Resin Rough grinding / plane preparation Aggressive, uniform plane
FEPA Grit 8 inch (200 mm) Order No. 10 inch (250 mm) Order No. 12 inch (300 mm) Order No. Package Bond Type Key Characteristics
80 04.02.110S 04.02.210S 04.02.310S 1 pc Resin Very aggressive plane grinding
120 04.02.120S 04.02.220S 04.02.320S 1 pc Resin Fast plane & fine grinding
200 04.02.125S 04.02.225S 04.02.325S 1 pc Resin Strong fine grinding stage
400 04.02.130S 04.02.230S 04.02.330S 1 pc Resin Fine grinding – excellent flatness
800 04.02.140S 04.02.240S 04.02.340S 1 pc Resin Very fine grinding / pre-polishing
1500 04.02.150S 04.02.250S 04.02.350S 1 pc Resin Ultra-fine grinding – near polishing quality
3000 04.02.160S 04.02.260S 04.02.360S 1 pc Resin Near-mirror finish, minimal damage
5000 04.02.170S 04.02.270S 04.02.370S 1 pc Resin Final grinding stage – mirror-prep ready
FEPA Grit 8 inch (200 mm) Order No. 10 inch (250 mm) Order No. 12 inch (300 mm) Order No. Package Bond Type Recommended Materials
80 04.01.110S 04.01.210S 04.01.310S 1 pc Nickel Very aggressive plane grinding – very hard materials
120 04.01.120S 04.01.220S 04.01.320S 1 pc Nickel Fast plane & fine grinding
200 04.01.125S 04.01.225S 04.01.325S 1 pc Nickel Strong fine grinding stage
400 04.01.130S 04.01.230S 04.01.330S 1 pc Nickel Fine grinding – excellent flatness
800 04.01.140S 04.01.240S 04.01.340S 1 pc Nickel Very fine grinding / pre-polishing
1200 04.01.150S 04.01.250S 04.01.350S 1 pc Nickel Ultra-fine grinding – near polishing quality
Grit (FEPA) Type 8" (200 mm) Order No. 10" (250 mm) Order No. 12" (300 mm) Order No. Package Quantity Backing Type Key Characteristics
60 Plain Back 03.01.101 03.01.401 03.01.701 50 pcs Plain Aggressive stock removal, initial plane grinding
120 Plain Back 03.01.103 03.01.403 03.01.703 100 pcs Plain Fast cutting, good for roughing
180 Plain Back 03.01.104 03.01.404 03.01.704 100 pcs Plain Balanced removal rate, reduced scratching
240 Plain Back 03.01.104-1 03.01.404-1 03.01.704-1 100 pcs Plain Fine plane grinding
320 Plain Back 03.01.105 03.01.405 03.03.705 100 pcs Plain Pre-fine grinding, improved flatness
400 Plain Back 03.01.106 03.01.406 03.01.706 100 pcs Plain Fine grinding stage
800 Plain Back 03.01.108 03.01.408 03.01.708 100 pcs Plain Pre-polish quality
1200 Plain Back 03.01.110 03.01.410 03.01.710 100 pcs Plain Near-polish finish, low deformation
60 PSA 03.02.401 03.02.500 03.02.801 50 pcs PSA Quick-stick, secure hold for coarse grinding
120 PSA 03.02.403 03.02.503 03.02.803 100 pcs PSA Fast adhesion, no clamping rings
180 PSA 03.02.404 03.02.504 03.02.804 100 pcs PSA Reliable wet performance
240 PSA 03.02.404-1 03.02.504-1 03.02.804-1 100 pcs PSA Consistent fine grinding
320 PSA 03.02.405 03.02.505 03.02.805 100 pcs PSA Excellent flatness
400 PSA 03.02.406 03.02.506 03.02.806 100 pcs PSA Fine surface prep
800 PSA 03.02.408 03.02.508 03.02.808 100 pcs PSA High edge retention
1200 PSA 03.02.410 03.02.510 03.02.810 100 pcs PSA Mirror-prep stage
Grit (FEPA) Type 8" (200 mm) Order No. 10" (250 mm) Order No. 12" (300 mm) Order No. Package Quantity Backing Type Key Features
120 Plain Back 03.03.103 03.03.403 03.03.703 50 pcs Plain Aggressive removal, initial plane grinding
180 Plain Back 03.03.104 03.03.404 03.03.704 100 pcs Plain Fast stock removal, good for roughing
400 Plain Back 03.03.107 03.03.407 03.03.707 100 pcs Plain Fine grinding, reduced scratching
800 Plain Back 03.03.109 03.03.409 03.03.709 100 pcs Plain Pre-polish stage, improved flatness
1200 Plain Back 03.03.111 03.03.411 03.03.711 100 pcs Plain Near-polish finish, low deformation
2000 Plain Back 03.03.113 03.03.413 03.03.713 100 pcs Plain Ultra-fine grinding
2500 Plain Back 03.03.114 03.03.414 03.03.714 100 pcs Plain High surface quality
2400 Plain Back 03.03.115 03.03.415 03.03.715 100 pcs Plain Mirror-prep stage
4000 Plain Back 03.03.116 03.03.416 03.03.716 100 pcs Plain Final grinding, minimal subsurface damage
120 PSA 03.04.203 03.04.503 03.04.803 50 pcs PSA (self-adhesive) Quick-stick application, no clamping rings
180 PSA 03.04.204 03.04.504 03.04.804 100 pcs PSA Fast adhesion, secure hold
400 PSA 03.04.207 03.04.507 03.04.807 100 pcs PSA Easy changeover, consistent flatness
800 PSA 03.04.209 03.04.509 03.04.809 100 pcs PSA Reliable bonding during wet use
1200 PSA 03.04.211 03.04.511 03.04.811 100 pcs PSA High edge retention
2000 PSA 03.04.213 03.04.513 03.04.813 100 pcs PSA Fine surface prep
2500 PSA 03.04.214 03.04.514 03.04.814 100 pcs PSA Excellent for delicate materials
2400 PSA 03.04.215 03.04.515 03.04.815 100 pcs PSA Near-mirror finish
4000 PSA 03.04.216 03.04.516 03.04.816 100 pcs PSA Ultra-fine grinding
Disc Type Recommended Hardness Range Recommended Diamond Suspension Key Advantages Available Diameters Package Format
POS < 150 HV to 450 HV 9 μm – 3 μm diamond suspension or spray Medium to low hardness; softer/composite materials; high flatness; reduced steps 200 mm, 250 mm, 300 mm, 350 mm Sold individually or in sets (contact for bulk)
POH > 150 HV (medium to high) 15 μm – 6 μm diamond suspension or spray Higher hardness materials; exceptional removal rate; long service life; superior reproducibility 200 mm, 250 mm, 300 mm, 350 mm Sold individually or in sets (contact for bulk)
Common Features Both types offer: higher grinding efficiency vs. SiC paper, lower elasticity for better flatness, reduced grinding steps, lower consumable consumption, eco-friendly process Consistent high removal rate, minimal media changes, high experimental reproducibility 200 mm, 250 mm, 300 mm, 350 mm
Parameter Details (Standard - TJ 2400) Details (Low-Viscosity - TJ 2404)
Model GHEXA-MNT-CON-ACR-016 GHEXA-MNT-CON-ACR-016
Material Type UV-Curing Acrylic Resin (Single-Component) UV-Curing Acrylic Resin (Single-Component)
Curing Method Low-energy UV light Low-energy UV light
Curing Time 30-60 seconds Approximately 2 minutes
Exotherm / Heat Release Very low Very low
Viscosity Medium Low (enhanced flowability)
Appearance after Cure High transparency / crystal clear High transparency / crystal clear
Hardness (Shore D, typical) ~78-82 ~78-82
Shrinkage Rate Low Low
Additional Features Fastest curing for rapid batch prep; minimal heat generation Superior flow and penetration; ideal for complex shapes or vacuum assist
Package Size 1 kg 1 kg
Parameter Details
Model GHEXA-MNT-CON-EPO-015
Material Type Conductive Epoxy Resin (Cold Mounting)
Components Part A: Conductive Epoxy Resin (Liquid), Part B: Hardener (Liquid)
Mixing Ratio (A:B w/w) 2:1
Mixing Time 5-10 minutes
Curing Time (at 25°C) 2-3 hours
Peak Exotherm Temperature 90°C
Hardness (Shore D) 82
Appearance Colorless and transparent (with conductive properties)
Edge Retention Excellent
Shrinkage Rate Very low
Additional Features Electrically conductive for SEM/EDS use; superior flowability, strong adhesion, high chemical resistance; eliminates need for carbon/gold coating on non-conductive samples; suitable for vacuum impregnation
Parameter Details
Model GHEXA-MNT-CON-EPO-014
Material Type Epoxy Resin (Cold Mounting)
Components Part A: Epoxy Resin (Liquid), Part B: Hardener (Liquid)
Mixing Ratio (A:B w/w) 2:1
Mixing Time 10-20 minutes
Curing Time (at 25°C) 8-12 hours
Peak Exotherm Temperature 40°C
Hardness (Shore D) 80
Appearance Colorless and transparent
Edge Retention Better
Shrinkage Rate Very low
Additional Features Excellent flowability, superior adhesion, high chemical resistance and stability; low exotherm for heat-sensitive samples; versatile for both routine and precision mounting
 
Parameter Details
Model GHEXA-MNT-CON-EPO-013
Material Type Low-Viscosity Epoxy Resin (Cold Mounting)
Components Part A: Epoxy Resin (Liquid), Part B: Hardener (Liquid)
Mixing Ratio (A:B w/w) 3:1
Pot Life 30-60 minutes
Mixing Time 3-5 minutes (recommended)
Cure Time (at 25°C) 10-12 hours (full cure)
Peak Exotherm Temperature <32°C
Hardness (Shore D) 80
Appearance Colorless and transparent
Edge Protection Better
Viscosity Low (excellent flow and penetration)
Additional Features Superior adhesion, very low shrinkage, high chemical resistance; ideal for vacuum impregnation and complex/porous samples
Parameter Details
Model GHEXA-MNT-CON-EPO-012
Material Type Epoxy Resin (Cold Mounting)
Components Part A: Epoxy Resin (Liquid), Part B: Hardener (Liquid)
Mixing Ratio (A:B w/w) 4.5:1
Mixing Time 5-10 minutes
Curing Time (at 25°C) 45-90 minutes
Peak Exotherm Temperature 125°C
Hardness (Shore D) 82
Appearance Colorless and transparent
Edge Retention Excellent
Shrinkage Rate Very low
Additional Features Superior flowability, strong adhesion, high chemical resistance and stability; suitable for vacuum impregnation when maximum clarity and void-free embedding are required
Parameter Specification
Product Model GHEXA-MNT-CON-EPO-011
Material Type Epoxy Resin Mounting Compound
System Two-Part (Liquid Resin + Liquid Hardener)
Appearance Colorless, transparent
Part A Epoxy Resin, Liquid
Part B Hardener, Liquid
Mixing Ratio (A:B, w/w) 2 : 1
Mixing Time 5–10 minutes
Curing Time @ 25 °C 1–2 hours
Peak Exothermic Temperature 112 °C
Hardness Shore D 78
Edge Retention Good
Flowability Excellent
Shrinkage Low
Adhesion Strong
Chemical Stability Superior
Mold Reference Φ30 mm mold at 20–25 °C
Solvent Compatibility Cured resin removable with Trojan DSV10 solvent