Description

SemiPOL High Precision Quantitative Grinding Machine GHEXA-GRP-EQP-AUT-007

The GHEXA-GRP-EQP-AUT-007 SemiPOL is a high-precision, quantitative grinding and polishing system engineered for micron-level accuracy in preparing delicate and critical samples. With real-time removal display on a 7-inch touchscreen, ±2 µm stable accuracy, maximum 10 mm removal depth (1 µm resolution), and independent servo-driven disc (0–350 rpm) and sample head (0–50 rpm) with oscillation and rotation, it excels at parallel thinning, controlled material removal, and ultra-flat surfaces. Ideal for semiconductor wafers, ICs, optical components, petrographic thin sections, optical fibers, and precision metal parts, SemiPOL ensures reproducible preparation for SEM, FIB, TEM, and optical microscopy in advanced research, failure analysis, and quality assurance labs.

Specifications

Key Applications & Uses

• Precision thinning and parallel grinding of semiconductor wafers, integrated circuits, and microelectronic packages for cross-sectional SEM/FIB/TEM analysis
• Controlled material removal and polishing of optical components, lenses, prisms, and optical fibers to achieve sub-micron flatness and surface quality
• Preparation of petrographic thin sections and rock/mineral samples for transmitted/reflected light microscopy and geological analysis
• Quantitative grinding of precision metal parts, coatings, and thin films for layer thickness measurement, interface studies, and failure investigation
• High-accuracy sample preparation in university materials science, nanotechnology, photonics, and semiconductor R&D laboratories
• Supporting quality control and process validation in electronics manufacturing, pharma (drug delivery microstructures), biotech (microfluidic devices), and advanced optics industries

Why Choose from G-Hexa?

• Micron-Level Precision — Achieves ±2 µm stable removal accuracy with 1 µm resolution and <2 µm flatness/parallelism, delivering damage-free, ultra-flat surfaces critical for high-resolution microscopy.
• Quantitative & Repeatable — Real-time removal monitoring, 16 programmable recipes, and servo-driven constant torque ensure exact depth control and consistent results across batches and operators.
• Versatile Motion Control — Independent variable-speed disc and sample head with rotation + adjustable oscillation accommodate diverse materials and complex geometries without compromising accuracy.
• User-Friendly & Durable — Intuitive 7-inch touchscreen, easy program editing, built-in cooling fan, large side drainage, and pluggable faucet minimize downtime and simplify maintenance in daily lab use.
• Extensive Accessory Range — Supports flat pasting, tear-drop, multifunctional, side-sticking, side-clamping, and vacuum suction fixtures plus digital height gauge for handling wafers, fibers, irregular parts, and custom samples.
• Trusted Lab Partner — G-Hexa provides seamless integration with our metallographic consumables and upstream/downstream systems, fast delivery across India, competitive pricing, and expert technical support tailored to semiconductor, optics, petrography, and precision materials workflows.

Frequently Asked Questions (FAQs)

Q: What level of precision can the GHEXA-GRP-EQP-AUT-007 achieve? A: It delivers ±2 µm stable removal accuracy, 1 µm resolution, disc flatness <2 µm, and head-to-disc perpendicularity/parallelism <2 µm—ideal for micron-critical applications like semiconductor and optical sample preparation.

Q: Does the machine support quantitative (depth-controlled) grinding? A: Yes—it features precise quantitative removal up to 10 mm with real-time display and high stability, making it perfect for controlled thinning and parallel grinding.

Q: What sample types and shapes can be processed? A: It handles wafers, ICs, optical components, fibers, petrographic sections, precision metals, and more using a wide range of fixtures: flat pasting, tear-drop, multifunctional, side-sticking, side-clamping, and vacuum suction.

Q: Are the disc and sample head speeds independently adjustable? A: Yes—both are continuously variable (disc 0–350 rpm, head 0–50 rpm), with CW/CCW direction and adjustable oscillation/rotation on the head for optimized processing of different materials.

Q: How many programs can be stored? A: Up to 16 sets of process parameters can be saved and edited directly on the 7-inch touchscreen for quick recall and repeatable workflows.

Q: What maintenance features are included? A: A built-in temperature-sensing fan prevents overheating, large side drainage avoids clogging, and a pluggable faucet allows fast, thorough cleaning of the disc—ensuring long-term reliability.

Q: Is it suitable for high-precision microscopy preparation? A: Absolutely—designed specifically for SEM, FIB, TEM, and optical microscopy prep, it provides the ultra-flat, deformation-free surfaces required for high-resolution imaging and analysis.