PF Diamond Grinding Film GHX-GRP-CON-GRD-DIA-007
| Micron Size | 8 inch (200 mm) Order No. | 10 inch (250 mm) Order No. | 12 inch (300 mm) Order No. | Package Quantity | Bond Type | Recommended Use Stage | Typical Surface Finish |
|---|---|---|---|---|---|---|---|
| 1 µm | 14.01.461-3 | 14.01.475-1 | 14.01.484-1 | 5 pcs | Resin | Final fine grinding / pre-polish | Near-mirror, Ra < 10 nm |
| 3 µm | 14.01.462-1 | 14.01.476-1 | 14.01.485-1 | 5 pcs | Resin | Fine grinding / intermediate polish | Very fine, low damage |
| 6 µm | 14.01.463-1 | 14.01.478-1 | 14.01.486-1 | 5 pcs | Resin | Medium-fine grinding | Smooth, controlled removal |
| 9 µm | 14.01.464-1 | 14.01.477-1 | 14.01.483-1 | 5 pcs | Resin | Medium grinding | Good flatness, minimal scratches |
| 15 µm | 14.01.465-1 | 14.01.479-1 | 14.01.487-1 | 5 pcs | Resin | Intermediate grinding | Fast stock removal, flat |
| 30 µm | 14.01.466-1 | 14.01.481-1 | 14.01.488-1 | 5 pcs | Resin | Rough grinding / plane preparation | Aggressive, uniform plane |
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Description
PF Diamond Grinding Film GHX-GRP-CON-GRD-DIA-007
Product Short Description The GHX-GRP-CON-GRD-DIA-007 PF Diamond Grinding Film is a precision-engineered, resin-bonded diamond lapping film series optimized for ultra-flat, low-damage fine grinding and pre-polishing of high-value samples. Available in 1 µm to 30 µm particle sizes, these films deliver exceptional surface uniformity, minimal subsurface damage, and superior edge retention—making them the preferred choice for polishing optical fiber connectors, ferrules, photonic chips, semiconductor dies, metallographic cross-sections, ceramics, glass, and other precision materials. Each film provides consistent, reproducible results with excellent durability, ideal for achieving mirror-like finishes in demanding research, telecom, semiconductor, and metallographic laboratories.
Specifications
| Micron Size | 8 inch (200 mm) Order No. | 10 inch (250 mm) Order No. | 12 inch (300 mm) Order No. | Package Quantity | Bond Type | Recommended Use Stage | Typical Surface Finish |
|---|---|---|---|---|---|---|---|
| 1 µm | 14.01.461-3 | 14.01.475-1 | 14.01.484-1 | 5 pcs | Resin | Final fine grinding / pre-polish | Near-mirror, Ra < 10 nm |
| 3 µm | 14.01.462-1 | 14.01.476-1 | 14.01.485-1 | 5 pcs | Resin | Fine grinding / intermediate polish | Very fine, low damage |
| 6 µm | 14.01.463-1 | 14.01.478-1 | 14.01.486-1 | 5 pcs | Resin | Medium-fine grinding | Smooth, controlled removal |
| 9 µm | 14.01.464-1 | 14.01.477-1 | 14.01.483-1 | 5 pcs | Resin | Medium grinding | Good flatness, minimal scratches |
| 15 µm | 14.01.465-1 | 14.01.479-1 | 14.01.487-1 | 5 pcs | Resin | Intermediate grinding | Fast stock removal, flat |
| 30 µm | 14.01.466-1 | 14.01.481-1 | 14.01.488-1 | 5 pcs | Resin | Rough grinding / plane preparation | Aggressive, uniform plane |
Key Applications & Uses
- Precision polishing of optical fiber connectors, ferrules, and end-faces (LC, SC, FC, MPO, MT) to achieve low insertion loss and high return loss
- Fine grinding and pre-polishing of semiconductor dies, photonic integrated circuits (PICs), and chip cross-sections for SEM, FIB, TEM inspection
- Preparation of metallographic samples (metals, alloys, ceramics, composites) requiring ultra-flat surfaces with minimal subsurface damage
- Lapping and polishing of glass, sapphire, silicon, ceramics, hard coatings, and advanced materials in photonics, optics, and materials research
- High-reproducibility grinding/polishing steps in quality control, failure analysis, and R&D labs for telecom, semiconductor, and microelectronics industries
- Supporting university photonics/optics labs, biotech (microfluidic devices), pharma (precision implants), and industrial manufacturing requiring nanometer-level surface quality
Why Choose from G-Hexa?
- Superior Surface Quality — Resin-bonded diamond films deliver exceptional flatness, low Ra values, and minimal subsurface damage—critical for optical fiber performance and high-resolution microscopy.
- Precise Grit Progression — Six carefully selected micron sizes (1–30 µm) allow smooth transition from rough plane grinding to near-mirror pre-polish in minimal steps.
- Long-Lasting & Consistent — High diamond concentration and durable resin bond provide excellent longevity and batch-to-batch reproducibility—reducing consumable cost and variability.
- Versatile & Easy to Use — Strong self-adhesive backing ensures secure mounting on standard platens; compatible with both manual and automatic grinders/polishers.
- Broad Industry Fit — Trusted performance in telecom (fiber optic connectors), semiconductor (die polishing), optics (glass/sapphire), and metallography—backed by G-Hexa’s full preparation ecosystem.
- Reliable Local Supply — Fast delivery across India, competitive pricing, expert technical support, and seamless integration with G-Hexa equipment and diamond suspensions for researchers, universities, pharma, biotech, and industrial labs.
Frequently Asked Questions (FAQs)
Q: What is the main advantage of PF diamond films over conventional SiC or alumina papers? A: PF films provide much faster removal rates, significantly better flatness, lower subsurface damage, and superior edge retention—especially important for optical fiber end-face polishing and semiconductor cross-sections.
Q: Which micron size should I use for optical fiber polishing? A: Most fiber optic workflows use: 30 µm or 15 µm → initial plane/rough grinding 9 µm or 6 µm → intermediate fine grinding 3 µm → fine pre-polish 1 µm → final pre-polish before silica colloidal suspension
Q: Can these films be used on automatic preparation systems? A: Yes—they perform excellently on both manual and automatic grinders/polishers (central or individual loading) when used with appropriate diamond suspension and moderate pressure.
Q: Do I need to use diamond suspension with PF films? A: Yes—pairing with 3–9 µm diamond suspension (or spray) dramatically increases cutting efficiency and final surface quality, especially on finer grits (1–9 µm).
Q: How long does one PF diamond film typically last? A: Depending on material hardness, load, and suspension usage — usually many times longer than SiC paper and comparable or longer than competing diamond films in routine fiber/metallographic preparation.
Q: Are PF films suitable for very soft or composite materials? A: Yes — the resin bond and controlled diamond size work well on many composites, polymers, and softer substrates, although very soft ductile metals (pure Cu, Al) may benefit from POS fine grinding discs in some cases.
Q: How should I clean and store the films? A: Rinse thoroughly with water or IPA after use to remove debris; store flat in the original packaging in a cool, dry place to maintain adhesive performance and prevent curling.
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