Manual Cut-off Machine GHEXA-CUT-EQP-MAN-006

Parameter Specification
Model GHEXA-CUT-EQP-MAN-006
Cutting Wheel Diameter Φ180 mm
Motor Power 0.9 kW
Wheel Speed 0–3000 rpm (adjustable)
Wheel Movement Y-axis (manual feed)
Cutting Modes Dry and wet cutting
Vising Table Size 350 × 370 mm
Maximum Cutting Diameter Φ30 mm
Maximum Square Cross-section 30 × 50 mm
Overall Dimensions (W×D×H) Closed: 470 × 505 × 359 mm Open: 470 × 556 × 631 mm
Weight 45 kg
Additional Features Fully transparent high-strength top cover for process observation, top cover “unlock” mode for oversized samples, T-slot clamping device for flexible fixture installation, motor cooling fan + overload protection, speed adjustment knob
  • Payment. Payment upon receipt of goods, Payment by card in the department, Google Pay, Online card, -5% discount in case of payment

  • Warranty. The Consumer Protection Act does not provide for the return of this product of proper quality.

Add to shortlist
Category:

Description

GHEXA-CUT-EQP-MAN-006 Manual Cut-off Machine The GHEXA-CUT-EQP-MAN-006 is a compact, benchtop manual cut-off machine engineered for precise, low-deformation sectioning of small and delicate samples. With a Φ180 mm cutting wheel, adjustable speed (0–3000 rpm), dual dry/wet cutting capability, transparent safety cover, and versatile T-slot clamping, it offers excellent visibility, ease of use, and reliable performance for everyday cutting tasks involving PCB boards, semiconductors, wafers, ceramics, quartz glass, and petrographic specimens in research, quality control, and teaching laboratories.

Specifications

Parameter Specification
Model GHEXA-CUT-EQP-MAN-006
Cutting Wheel Diameter Φ180 mm
Motor Power 0.9 kW
Wheel Speed 0–3000 rpm (adjustable)
Wheel Movement Y-axis (manual feed)
Cutting Modes Dry and wet cutting
Vising Table Size 350 × 370 mm
Maximum Cutting Diameter Φ30 mm
Maximum Square Cross-section 30 × 50 mm
Overall Dimensions (W×D×H) Closed: 470 × 505 × 359 mm Open: 470 × 556 × 631 mm
Weight 45 kg
Additional Features Fully transparent high-strength top cover for process observation, top cover “unlock” mode for oversized samples, T-slot clamping device for flexible fixture installation, motor cooling fan + overload protection, speed adjustment knob

Key Applications & Uses

  • Electronics & PCB sample preparation — Clean cutting of printed circuit boards, multilayer PCBs, solder joints, and electronic assemblies for failure analysis and quality inspection.
  • Semiconductor & wafer processing — Precise sectioning of silicon wafers, semiconductor dies, thin substrates, and microelectronic components with minimal chipping or edge damage.
  • Ceramics and brittle materials — Accurate cutting of technical ceramics, alumina, zirconia, and other hard/brittle specimens used in materials science and engineering research.
  • Quartz glass & optical components — Low-deformation slicing of quartz, fused silica, glass lenses, and optical substrates for photonics, optics, and laser applications.
  • Petrographic & geological thin-section preparation — Sectioning small rock fragments, minerals, drill cores, and petrographic samples for microscopic and analytical studies.
  • University teaching & student labs — Ideal for hands-on training in metallurgy, materials science, electronics, and geology courses due to its compact size, safety features, and straightforward manual operation.
  • R&D and small-scale quality control — Reliable daily cutting of experimental materials, prototypes, and incoming inspection samples in pharma tooling, biotech device manufacturing, and precision engineering labs.

Why Choose from G-Hexa?

  • Compact & bench-friendly design — At just 45 kg and with small footprint (470×505×359 mm closed), it fits easily on standard laboratory benches—perfect for space-constrained university, R&D, and QA environments.
  • Dual dry/wet cutting versatility — Supports both modes to accommodate a wide range of materials: wet for reduced dust and heat on hard/brittle samples, dry for quick convenience on suitable materials.
  • Superior visibility & safety — Fully transparent high-strength top cover allows clear observation of the cutting process, while the unlock mode accommodates oversized or awkwardly shaped samples without compromising safety.
  • Flexible & secure clamping — Generous 350×370 mm T-slot table with compatible fixtures enables fast, stable mounting of irregular, small, or thin workpieces—enhancing cut accuracy and repeatability.
  • Smooth, adjustable performance — Wide 0–3000 rpm speed range, overload-protected motor with cooling fan, and manual Y-axis feed provide precise operator control and consistent results across diverse sample types.
  • Affordable reliability & support — Engineered for long-term durability and backed by G-Hexa’s prompt technical assistance, training resources, and ready availability of compatible Φ180 mm abrasive wheels and accessories—trusted by researchers, educators, and industrial labs across India.

Frequently Asked Questions (FAQs)

Q: What materials can the GHEXA-CUT-EQP-MAN-006 cut? A: It is optimized for PCB boards, semiconductors, silicon wafers, technical ceramics, quartz glass, optical materials, petrographic/rock samples, and other small hard or brittle specimens up to Φ30 mm diameter or 30×50 mm rectangular cross-section.

Q: Can I use it for both dry and wet cutting? A: Yes—the machine supports both modes. Wet cutting (with coolant) is recommended for most hard/brittle materials to minimize dust, heat, and surface damage; dry cutting is suitable for quick jobs on compatible samples.

Q: How does the “unlock” mode for the top cover work? A: The transparent cover can be set to unlock mode, allowing cutting of samples that protrude beyond the standard platform limits—useful for longer or irregularly shaped workpieces while maintaining visibility and basic splash protection.

Q: Is the machine easy to operate for beginners or students? A: Yes—its manual Y-axis feed, adjustable speed knob, clear top cover, and straightforward T-slot clamping make it user-friendly and ideal for teaching labs, student training, and entry-level quality control tasks.

Q: What type of abrasive wheels should I use? A: Standard Φ180 mm resin- or rubber-bonded cut-off wheels are compatible. Choose SiC-based wheels for non-ferrous, ceramics, and glass; Al₂O₃-based for metals. G-Hexa supplies optimized wheels for your specific materials.

Q: Does it require special installation or power? A: No complex installation is needed—it operates on standard single-phase 220–240 V, 50 Hz power (common in Indian labs). Simply place on a stable bench, connect, and start using. G-Hexa provides setup guidance.

Q: How do I manage coolant when using wet mode? A: Connect a simple recirculating coolant system or use a drip-feed setup (not included). The machine’s design accommodates wet operation effectively; consult G-Hexa for recommended coolant accessories if needed.

Reviews

There are no reviews yet.

Be the first to review “Manual Cut-off Machine GHEXA-CUT-EQP-MAN-006”

Your email address will not be published. Required fields are marked *

Empowering Labs with Advanced Characterisation, Consumables & Research Equipments

Shopping Cart

Add Rs.300.00 to cart and get free shipping!

No products in the cart.

Free Shipping on All Orders Over $750

Type the product you want to search for and press enter.

Raise A Request Form