FlexPRESS-M/S Automatic Modular Hot Mounting System GHEXA-MNT-EQP-HOT-003

Parameter Specification (FlexPRESS-M) Specification (FlexPRESS-S)
Model GHEXA-MNT-EQP-HOT-003 (M variant) GHEXA-MNT-EQP-HOT-003 (S variant)
Power 2.0 kW 2.0 kW
Temperature Range 100–200 °C 100–200 °C
Pressure Range 0–500 Bar 0–500 Bar
Heating Mode Circumferential + Top Heating Circumferential + Top Heating
Cooling Mode Three-stage Cooling (automatic) Three-stage Cooling (automatic)
Control Fully Automatic Fully Automatic
Display 7-inch Touchscreen with 16 preset process parameters 7-inch Touchscreen with 16 preset process parameters
Number of Sleeves/Modules 1 (expandable up to 5 modules) 1 (expandable up to 5 modules)
Additional Features Pre-heating & pre-pressing, adjustable heating power/speed, automatic/manual sliding cover, optional circulating water tank Pre-heating & pre-pressing, adjustable heating power/speed, automatic/manual sliding cover, optional circulating water tank
Dimensions (W×D×H) 300 × 561 × 492 mm 254 × 550 × 492 mm
Weight 60 kg 52 kg
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Description

FlexPRESS-M/S Automatic Modular Hot Mounting System GHEXA-MNT-EQP-HOT-003 The FlexPRESS-M/S GHEXA-MNT-EQP-HOT-003 is an advanced, fully automatic modular hot mounting system engineered for high-throughput, consistent, and repeatable sample encapsulation in demanding metallographic laboratories. Its innovative modular architecture allows a single main unit to support up to five independent mounting modules, enabling simultaneous or sequential processing of multiple samples with different sizes, resins, or parameters. Featuring top + circumferential heating, three-stage cooling, pre-heating/pre-pressing functions, a 7-inch touchscreen with 16 preset programs, and automatic/manual sliding cover operation, it delivers superior edge retention, minimal porosity, and exceptional efficiency for modern materials analysis workflows.

Specifications

Parameter Specification (FlexPRESS-M) Specification (FlexPRESS-S)
Model GHEXA-MNT-EQP-HOT-003 (M variant) GHEXA-MNT-EQP-HOT-003 (S variant)
Power 2.0 kW 2.0 kW
Temperature Range 100–200 °C 100–200 °C
Pressure Range 0–500 Bar 0–500 Bar
Heating Mode Circumferential + Top Heating Circumferential + Top Heating
Cooling Mode Three-stage Cooling (automatic) Three-stage Cooling (automatic)
Control Fully Automatic Fully Automatic
Display 7-inch Touchscreen with 16 preset process parameters 7-inch Touchscreen with 16 preset process parameters
Number of Sleeves/Modules 1 (expandable up to 5 modules) 1 (expandable up to 5 modules)
Additional Features Pre-heating & pre-pressing, adjustable heating power/speed, automatic/manual sliding cover, optional circulating water tank Pre-heating & pre-pressing, adjustable heating power/speed, automatic/manual sliding cover, optional circulating water tank
Dimensions (W×D×H) 300 × 561 × 492 mm 254 × 550 × 492 mm
Weight 60 kg 52 kg

Key Applications & Uses

  • High-volume metallographic sample preparation — Simultaneous mounting of multiple specimens for rapid grinding/polishing throughput in QA/QC and production laboratories.
  • Microstructural & hardness analysis — Produces flat, edge-protected mounts optimized for Vickers, Rockwell, Brinell, and microhardness testing with excellent planarity.
  • Failure analysis & forensic investigation — Encapsulates fractured parts, welds, coatings, and small components while preserving exact orientation and critical interfaces.
  • Electronics & semiconductor cross-sectioning — Reliable mounting of PCBs, IC packages, thin films, wire bonds, and microelectronic assemblies for precise layer analysis.
  • Advanced materials R&D — Handles metals/alloys, technical ceramics, composites, polymers, and hybrid materials in research and development settings.
  • Geological & petrographic studies — Mounts minerals, rock thin-sections, drill cores, and fragile geological samples for microscopic examination.
  • University teaching & multi-user labs — Scalable modular design supports diverse student projects, practical classes, and research groups in materials science, metallurgy, and engineering departments.
  • Pharma, biotech & precision manufacturing — Encapsulates tooling components, medical device parts, and corrosion coupons requiring reproducible preparation.

Why Choose from G-Hexa?

  • True modular scalability — Start with one module and expand up to five on a single main unit—perfect for growing labs or varying sample volumes without purchasing multiple standalone presses.
  • Superior heating uniformity & speed — Combined top + circumferential heating with pre-heating/pre-pressing functions ensures rapid, even resin curing, reduced cycle times, and minimized voids or shrinkage.
  • Three-stage intelligent cooling — Advanced staged cooling optimizes mount quality across different resins, preventing cracks, distortion, or edge rounding—critical for high-precision metallography.
  • User-centric automation — 7-inch touchscreen with 16 preset programs, real-time parameter monitoring, and automatic/manual sliding cover reduce operator involvement, training time, and variability.
  • Versatile & future-proof design — Supports a wide range of mold diameters and resin types; optional circulating water tank adds cooling flexibility for temperature-sensitive or high-throughput applications.
  • Compact, quiet & efficient — Space-saving footprint, low noise, and energy-efficient 2.0 kW power make it ideal for university, R&D, pharma, biotech, and industrial labs in India.
  • Reliable performance & local support — Precision-engineered for long-term durability, backed by G-Hexa’s expert technical service, operator training, fast spare parts availability, and complete supply of compatible mounting media and molds.

Frequently Asked Questions (FAQs)

Q: What makes the FlexPRESS-M/S different from conventional hot mounting presses? A: Its modular design allows one main unit to control up to five independent mounting modules, enabling batch processing, mixed sample sizes/resins, and significantly higher throughput compared to single- or dual-sleeve traditional presses.

Q: Can different mold sizes be used at the same time? A: Yes—each module operates independently, so you can mount different diameters (e.g., 25 mm, 30 mm, 50 mm) or resin types simultaneously, maximizing flexibility in multi-sample workflows.

Q: What mounting resins are compatible? A: It works with phenolic (bakelite), epoxy, acrylic, and other thermosetting resins. Select based on sample heat sensitivity, hardness, edge retention needs, or transparency requirements—G-Hexa supplies optimized high-quality resins.

Q: How does the three-stage cooling improve results? A: Staged cooling applies controlled temperature reduction phases, minimizing thermal stress, preventing cracks or bubbles, and delivering superior mount integrity—especially valuable for brittle or heat-sensitive samples.

Q: Is pre-heating and pre-pressing useful? A: Yes—these functions soften the resin and apply initial pressure before full heating, reducing voids, improving flow around complex geometries, and enhancing overall mount quality and edge retention.

Q: What cooling options are available? A: The system uses built-in three-stage air/water cooling; an optional circulating water tank provides enhanced closed-loop cooling for faster cycles or labs without direct water supply.

Q: How user-friendly is the touchscreen interface? A: Extremely—the 7-inch touchscreen offers intuitive navigation, 16 preset programs for common resins/samples, and real-time monitoring of temperature, pressure, and cycle progress—ideal for multi-user labs.

Q: What power and installation requirements apply? A: Standard single-phase 220 V supply. The compact design requires minimal space and simple water connection (if using water cooling). G-Hexa provides full electrical specs, on-site installation guidance, and operator training with every system.

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