Description

GHEXA-CUT-EQP-AUTO-005 Automatic Precision Cut-Off Machine The GHEXA-CUT-EQP-AUTO-005 is a compact, high-precision automatic cut-off machine designed for accurate, low-deformation sectioning of small to medium-sized samples. With a Φ200 mm cutting wheel, variable speed control (500–3000 rpm), stepless feed rate (0.01–5 mm/s), 5-inch touchscreen interface, laser alignment, and versatile fixturing options, it delivers exceptional cutting quality on metals, PCB boards, semiconductors, crystals, ceramics, quartz glass, rocks, and other delicate or hard materials—ideal for research, quality control, and failure analysis laboratories.

Specifications

Key Applications & Uses

• Precision metallographic preparation — Clean, low-heat sectioning of small metal samples, thin sheets, wires, fasteners, and miniature components.
• Electronics & PCB failure analysis — Accurate cutting of printed circuit boards, electronic assemblies, solder joints, and multilayer PCBs without delamination or damage.
• Semiconductor & crystal materials — Gentle, precise slicing of silicon wafers, semiconductor dies, single crystals, and epitaxial substrates.
• Ceramics, quartz, and optical materials — Minimal chipping and edge damage when sectioning technical ceramics, quartz glass, sapphire, and other brittle optical components.
• Geological & petrographic sample preparation — Sectioning small rock fragments, mineral specimens, thin sections, and drill cores for microscopic analysis.
• Research & development laboratories — Versatile cutting of experimental alloys, composites, biomaterials, and novel materials in university, R&D, and prototype labs.
• Quality control & incoming inspection — Reliable, repeatable cuts for small-to-medium parts in automotive, aerospace, medical device, and precision manufacturing sectors.

Why Choose from G-Hexa?

• Superior precision & surface quality — Stepless feed rate (0.01–5 mm/s) and variable wheel speed (500–3000 rpm) combined with automatic feeding and overload protection ensure minimal material deformation, reduced heat-affected zones, and excellent edge retention—even on delicate or hard samples.
• Compact, benchtop-friendly design — At only 63 kg and with compact closed dimensions (570×717×405 mm), it fits easily on standard lab benches while offering generous 240 mm Y-travel and a 465×270 mm vising table for practical sample handling.
• User-intuitive touchscreen & laser guidance — 5-inch touchscreen with clear program control, joystick manual override, and laser alignment enable fast setup, accurate positioning, and consistent results with minimal training.
• Versatile fixturing for real-world samples — Standard and optional fixtures (including automatic clamping option) securely hold irregular, asymmetric, or small workpieces—expanding usability across metals, electronics, crystals, and more.
• Safe, reliable, low-maintenance operation — Built-in overload protection, automatic mode, and robust construction deliver worry-free performance in busy research, university, pharma tooling, biotech, and industrial QA environments.
• Complete ecosystem support — Backed by G-Hexa’s precision engineering, prompt service, operator training, and full range of compatible Φ200 mm abrasive wheels and accessories—trusted by labs across India.

Frequently Asked Questions (FAQs)

Q: What materials is the GHEXA-CUT-EQP-AUTO-005 best suited for? A: It excels with metals, PCB boards, semiconductors, crystals (e.g., silicon, sapphire), technical ceramics, quartz glass, rocks/minerals, composites, and other small-to-medium hard or brittle samples requiring high surface quality.

Q: Can it cut irregularly shaped or delicate workpieces? A: Yes—multiple fixture options (standard and optional automatic fixtures) allow secure clamping and precise cutting of irregular geometries, thin sections, small parts, and fragile materials.

Q: What is the advantage of the automatic feeding mode? A: Automatic feeding at a constant, user-set rate (0.01–5 mm/s) provides consistent pressure and speed, reducing operator fatigue, minimizing heat buildup, and delivering more uniform, repeatable cuts compared to purely manual operation.

Q: How precise is the laser alignment feature? A: The integrated laser clearly marks the exact cutting plane on the sample, enabling fast, accurate positioning and helping preserve critical features or achieve exact section locations.

Q: Does the machine include overload protection? A: Yes—built-in overload protection safeguards the motor, wheel, and sample during operation, preventing damage and ensuring consistent cutting performance even under varying load conditions.

Q: What abrasive wheels are compatible? A: It uses standard Φ200 mm resin- or rubber-bonded abrasive cut-off wheels. Select wheel type based on material (e.g., SiC for non-ferrous/hard materials, Al₂O₃ for steels). G-Hexa supplies optimized wheels and dressing tools.

Q: Is this machine suitable for benchtop use in small labs? A: Absolutely—its lightweight 63 kg design, compact footprint, and quiet operation make it ideal for university teaching labs, R&D benches, failure analysis rooms, and space-constrained quality control areas.

Q: What power supply is required? A: Standard single-phase 220–240 V, 50 Hz power (common in Indian laboratories). Exact electrical details are provided with each unit—G-Hexa offers full installation guidance and support.