Nanofabrication & Site-Specific Preparation
Focused Ion Beam (FIB) Micromachining & Sample Preparation
From site-specific lamella extraction to nanoscale cross-sectioning, FIB enables controlled material removal with nanometer precision. This capability transforms failure investigation, interface analysis, and correlative microscopy into actionable engineering insight.
Bridging FIB Precision with Industrial Decision-Making
In advanced materials systems, critical features are often buried beneath surfaces—interfaces, defects, voids, and reaction layers invisible to conventional methods. FIB serves as a direct bridge between hypothesis and proof, enabling targeted exposure of regions that govern performance and reliability.
Advanced FIB Capabilities
Our Focused Ion Beam (FIB) platform enables site-specific micromachining, precision cross-sectioning, TEM lamella preparation, and nanoscale material modification with exceptional control. From complex semiconductor devices to advanced alloys and multilayer coatings, we deliver high-accuracy material removal and structural exposure at nanometer resolution—supporting correlative microscopy and multi-technique characterization workflows.
Site-Specific Milling
Nanometer-scale material removal from targeted locations without disturbing surrounding structures.
TEM Lamella Preparation
Electron-transparent lamellae extracted with controlled thickness and crystallographic integrity.
Cross-Sectioning
High-fidelity exposure of multilayers, interfaces, coatings, and buried defects.
3D Tomography
Sequential slicing and reconstruction for volumetric microstructural analysis.
Expert Sample Preparation Workflow
High-quality analysis begins with high-quality preparation. Our expert-driven workflow integrates controlled milling strategies, low-damage polishing protocols, and geometry optimization tailored to the material system and analytical objective. Each specimen is prepared to preserve structural integrity and compositional accuracy, ensuring reliable downstream imaging and analysis.
- Assessment & Strategy: Defining regions of interest, material sensitivity, and preparation pathway.
- Protective Deposition: Ion- or electron-beam-assisted deposition to preserve surface integrity.
- Precision Milling: Progressive thinning with controlled beam current and angle.
- Final Polishing: Low-kV cleaning to minimize amorphization and ion damage.
Manufacturing–Microstructure Correlation
FIB enables direct visualization of subsurface features and failure origins within real components. By connecting machining conditions, fabrication processes, and operational stresses to microstructural outcomes, we help industries uncover root causes, validate process parameters, and refine production strategies for enhanced reliability and performance.
| Material Domain | FIB Insight | Optimization Impact |
|---|---|---|
| Semiconductors | Contact voids, interconnect delamination | Process tuning for yield and reliability |
| Coatings | Interface adhesion and layer uniformity | Improved coating durability |
| Composites | Fiber–matrix bonding | Enhanced mechanical performance |
High-Stakes Insight
In high-value investigations, precision interpretation is as critical as precision milling. Our specialists combine materials science expertise with hands-on FIB mastery to identify defects, interfaces, diffusion zones, and nanoscale anomalies that influence product performance. The result is defensible insight—supporting research breakthroughs, quality assurance, and mission-critical decision-making.
Early Detection
Targeting microvoids, cracks, and inclusions before catastrophic failure.
Root Cause Analysis
Direct visualization of failure origins across layers and interfaces.
From Failure Analysis to Future Material Systems
Each FIB investigation generates data that feeds innovation—enabling defect-tolerant architectures, optimized interfaces, and next-generation material systems engineered for performance under extreme conditions. Focused Ion Beam (FIB) Micromachining serves as a critical bridge between understanding material failure and engineering next-generation solutions. By enabling precise cross-sectioning and site-specific sample extraction, FIB reveals crack initiation sites, interface degradation, diffusion layers, and nanoscale defects that govern component reliability.
FIB Precision Access to the Nanoscale
Focused Ion Beam (FIB) Micromachining enables site-specific sectioning, nanometer-scale material removal, and high-fidelity sample preparation—revealing subsurface structures that conventional methods cannot reach.
Atomic Precision for Industrial Decisions
Tell us your challenge. We’ll design a targeted FIB preparation strategy and convert nanoscale insight into action.