Fully Automatic Intelligent Sample Preparation System GHEXA-GRP-EQP-AUT-002
| Parameter | Specification |
|---|---|
| Model | GHEXA-GRP-EQP-AUT-002 |
| Power Supply | AC 220V / 50 Hz + Ground; Total Power: 7 kW, Rated Power: 2 kW |
| Compressed Air | 0.6–0.7 MPa, Hose OD Φ10 mm |
| External Water Supply | <0.3 MPa, Pipe OD Φ10 mm |
| Drainage | Drain Pipe OD 32 mm |
| Sample Mounting Box Sizes | 39×47×12 mm / 30×27×12 mm; Max Quantity: 21 |
| Alignment System | 25 Megapixel CCD Camera; Field of View: 35×35 mm; Grinding Precision: ±10 μm |
| Laser Marking/Reading | Yes; Max Number of Lines: 30; Line Drawing: Specified distance translation |
| Grinding/Polishing Stations | 2 Stations; Disc Diameter: Φ254 mm; Rotation Speed: 100–1000 rpm; Motor: 1 kW |
| Grinding Head | Holds 3 Samples; Motor: 0.4 kW; Speed: 0–360° reciprocating swing; Pressure: 5–100 N |
| Dispensing System | 4 Groups × 1.8 L each; Flow Rate: 0–50 ml/min; Mechanical Stirring: 2 Groups; Liquid Level Alert: Yes |
| Disc Storage | 20 Grinding/Polishing Discs; Disc Life Alert: Usage count or force-based |
| Cleaning Station | Water Rinse + Ultrasonic + High-Speed Spin-Dry + Independent Air Blow-Dry |
| Control System | PLC + 15-inch Main Screen + 7-inch Auxiliary Screen; Dual 24-inch Computer Displays |
| Safety Features | Emergency Stop, Safety Door Lock (PLd level), Three-Color Alarm Light |
| Program Library | 30 Program Groups; Max 10 Steps per Program; End Conditions: Remaining/Grind Amount (min 0.001 mm) or Time |
| Grinding Modes | By Pressure (0–100 N) or Speed (min 0.001 mm/s) |
| Sample Output | Face-up, orderly arranged in recovery tray to prevent surface scratching |
| Dimensions (Screen & Light Folded) | 2400 × 1320 × 2000 mm |
| Weight | 1500 kg |
Payment. Payment upon receipt of goods, Payment by card in the department, Google Pay, Online card, -5% discount in case of payment
Warranty. The Consumer Protection Act does not provide for the return of this product of proper quality.
Description
Fully Automatic Intelligent Sample Preparation System GHEXA-GRP-EQP-AUT-002
Product Short Description The GHEXA-GRP-EQP-AUT-002 Fully Automatic Intelligent Sample Preparation System is an advanced, high-precision automated grinding and polishing solution engineered for cross-sectional analysis in semiconductor, PCB, electronics, and advanced materials laboratories. Utilizing a high-resolution 25-megapixel CCD camera for precise in-situ positioning (±10 μm grinding accuracy), it fully automates rough grinding, fine grinding, fine polishing, and cleaning processes. Capable of handling up to 3 samples simultaneously, with multi-line calibration, automatic angle correction, laser traceability, dual workstations with 20-disc auto-changeover, and intelligent dispensing of 4 polishing fluids, this system delivers consistent, repeatable, damage-free cross-sections for detailed inspection of PCB vias, copper layers, solder joints, BGA balls, and microelectronic features—ideal for failure analysis, quality control, and process validation in high-tech R&D and production environments.
Specifications
| Parameter | Specification |
|---|---|
| Model | GHEXA-GRP-EQP-AUT-002 |
| Power Supply | AC 220V / 50 Hz + Ground; Total Power: 7 kW, Rated Power: 2 kW |
| Compressed Air | 0.6–0.7 MPa, Hose OD Φ10 mm |
| External Water Supply | <0.3 MPa, Pipe OD Φ10 mm |
| Drainage | Drain Pipe OD 32 mm |
| Sample Mounting Box Sizes | 39×47×12 mm / 30×27×12 mm; Max Quantity: 21 |
| Alignment System | 25 Megapixel CCD Camera; Field of View: 35×35 mm; Grinding Precision: ±10 μm |
| Laser Marking/Reading | Yes; Max Number of Lines: 30; Line Drawing: Specified distance translation |
| Grinding/Polishing Stations | 2 Stations; Disc Diameter: Φ254 mm; Rotation Speed: 100–1000 rpm; Motor: 1 kW |
| Grinding Head | Holds 3 Samples; Motor: 0.4 kW; Speed: 0–360° reciprocating swing; Pressure: 5–100 N |
| Dispensing System | 4 Groups × 1.8 L each; Flow Rate: 0–50 ml/min; Mechanical Stirring: 2 Groups; Liquid Level Alert: Yes |
| Disc Storage | 20 Grinding/Polishing Discs; Disc Life Alert: Usage count or force-based |
| Cleaning Station | Water Rinse + Ultrasonic + High-Speed Spin-Dry + Independent Air Blow-Dry |
| Control System | PLC + 15-inch Main Screen + 7-inch Auxiliary Screen; Dual 24-inch Computer Displays |
| Safety Features | Emergency Stop, Safety Door Lock (PLd level), Three-Color Alarm Light |
| Program Library | 30 Program Groups; Max 10 Steps per Program; End Conditions: Remaining/Grind Amount (min 0.001 mm) or Time |
| Grinding Modes | By Pressure (0–100 N) or Speed (min 0.001 mm/s) |
| Sample Output | Face-up, orderly arranged in recovery tray to prevent surface scratching |
| Dimensions (Screen & Light Folded) | 2400 × 1320 × 2000 mm |
| Weight | 1500 kg |
Key Applications & Uses
- Automated cross-sectional preparation of PCBs, semiconductor packages, ICs, BGAs, and microelectronic assemblies for via/hole inspection, copper plating, solder joint, and intermetallic layer analysis
- Precision grinding/polishing for failure analysis (FA), reliability testing, and process qualification in electronics manufacturing and quality assurance labs
- High-accuracy sectioning of multilayer PCBs to evaluate buried features, delamination, voids, cracks, and plating thickness uniformity
- Preparation of samples for optical microscopy, SEM, X-ray, and other surface analysis techniques in semiconductor R&D and production
- Batch processing of multiple mounted samples with multi-line calibration for efficient high-throughput workflows in contract testing and OEM facilities
- Supporting advanced materials research, electronics failure investigation, and quality control in universities, pharma (drug delivery devices), biotech (microfluidics), and industrial electronics labs
Why Choose from G-Hexa?
- Unmatched Grinding Precision — 25 MP CCD camera with ±10 μm accuracy and automatic angle correction ensures reproducible, damage-free cross-sections even on tilted or challenging samples.
- Fully Hands-Free Automation — Complete process from calibration to cleaning—including auto disc changeover (20 discs), multi-fluid dispensing with stirring, ultrasonic cleaning, and air drying—minimizes operator intervention and variability.
- High Throughput & Flexibility — Simultaneous processing of up to 3 samples, 30 programmable lines per sample, 30 program groups, and intelligent pressure/speed control for diverse sample types and requirements.
- Traceability & Safety Built-In — Laser marking/reading for sample ID, face-up orderly output to prevent scratches, PLd-level safety interlocks, emergency stop, and three-color alarm for secure, compliant laboratory operation.
- Intelligent & User-Friendly — Dual large-screen interface, liquid level alerts, disc life monitoring, and precise end-condition control (down to 0.001 mm) deliver consistent results with minimal training.
- Trusted Local Expertise — G-Hexa provides end-to-end support, fast delivery across India, competitive pricing, and seamless integration into electronics, semiconductor, and materials analysis workflows—preferred by leading research institutions and high-tech industries.
Frequently Asked Questions (FAQs)
Q: What is the grinding precision of the GHEXA-GRP-EQP-AUT-002 system? A: It achieves ±10 μm grinding accuracy thanks to the high-resolution CCD camera and automatic positioning system.
Q: How many samples can be processed at the same time? A: The system holds and processes up to 3 samples simultaneously on the grinding head for parallel preparation.
Q: Does the system automatically correct for sample tilt? A: Yes—it detects and automatically adjusts the grinding angle to compensate for any tilt introduced during mounting.
Q: What types of polishing fluids are supported? A: It features 4 independent 1.8 L dispensing groups (2 with mechanical stirring), all with liquid level alerts, allowing use of different suspensions or lubricants as required.
Q: How does the system ensure sample traceability? A: Built-in laser marking and reading capability allows permanent ID coding and tracking of up to 30 lines per sample.
Q: What happens after the preparation process is complete? A: Finished samples are automatically placed face-up in an orderly arrangement in the recovery tray to avoid scratching the prepared surface.
Q: Is the system suitable for high-volume production labs? A: Yes—dual workstations, 20-disc auto-changeover, multi-sample capability, and programmable process library make it ideal for efficient, repeatable high-throughput cross-section preparation in semiconductor and PCB environments.
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