Product Short Description
GHEXA-MNT-CON-EPO-011 Epoxy Resin Mounting Compound (2:1) is a versatile, colorless, and highly transparent epoxy embedding system designed for precision cold mounting and routine laboratory sample preparation. Formulated for excellent flowability, strong adhesion, low shrinkage, and superior chemical stability, this two-part epoxy ensures deep penetration into fine structures and produces clear, distortion-free mounts. With a controlled 1–2 hour curing time at 25 °C, it provides extended working time for careful positioning of samples, making it ideal for detailed metallographic, electronic, and research applications.
Specifications
| Parameter |
Specification |
| Product Model |
GHEXA-MNT-CON-EPO-011 |
| Material Type |
Epoxy Resin Mounting Compound |
| System |
Two-Part (Liquid Resin + Liquid Hardener) |
| Appearance |
Colorless, transparent |
| Part A |
Epoxy Resin, Liquid |
| Part B |
Hardener, Liquid |
| Mixing Ratio (A:B, w/w) |
2 : 1 |
| Mixing Time |
5–10 minutes |
| Curing Time @ 25 °C |
1–2 hours |
| Peak Exothermic Temperature |
112 °C |
| Hardness |
Shore D 78 |
| Edge Retention |
Good |
| Flowability |
Excellent |
| Shrinkage |
Low |
| Adhesion |
Strong |
| Chemical Stability |
Superior |
| Mold Reference |
Φ30 mm mold at 20–25 °C |
| Solvent Compatibility |
Cured resin removable with Trojan DSV10 solvent |
Ordering Information
| Order No. |
Description |
Package |
| 02.04.711 |
Epoxy Resin, Liquid |
2 lb |
| 02.04.712 |
Epoxy Hardener, Liquid |
1 lb |
| 02.04.721 |
Epoxy Resin, Liquid |
2 kg |
| 02.04.722 |
Epoxy Hardener, Liquid |
1 kg |
Key Applications & Uses
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Cold mounting of metallographic and materials testing samples
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Semiconductor and PCB cross-section preparation
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Electronic component encapsulation
-
Failure analysis and quality assurance studies
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Grinding, polishing, and microstructural examination
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Research and teaching laboratories
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Routine or batch sample preparation requiring longer working time
Why Choose from G-Hexa?
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Crystal-Clear Transparency – Ideal for detailed optical inspection and microscopy
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Extended Working Time – 1–2 hour cure allows careful sample placement and degassing
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Low Shrinkage Stability – Maintains dimensional accuracy and reduces edge gaps
-
Consistent Lab Performance – Reliable hardness and curing results across batches
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Expert Technical Support – Guidance on mounting methods and consumables selection
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Trusted Laboratory Supplier – G-Hexa serves universities, pharma, biotech, and industrial labs with dependable, high-quality preparation materials
Frequently Asked Questions (FAQs)
Q1: What mixing ratio is required for this epoxy?
Mix Part A and Part B at a 2:1 weight ratio. Stir thoroughly for 5–10 minutes for uniform curing.
Q2: How long does it take to cure?
At 25 °C, the resin cures within 1–2 hours, providing adequate time for positioning and bubble removal.
Q3: When should I choose this product over faster-curing epoxies?
This formulation is ideal when you need longer working time for precise alignment, complex samples, or vacuum impregnation.
Q4: Does it provide good edge retention during polishing?
Yes. The Shore D hardness of 78 and good edge retention ensure clean, stable sample boundaries.
Q5: Is the cured resin removable?
Yes. Trojan DSV10 solvent can dissolve the cured epoxy if rework or cleaning is required.
Q6: Which industries typically use this mounting compound?
It is widely used in research institutions, universities, pharmaceutical and biotech labs, and industrial QA/QC facilities for reliable and repeatable sample preparation.
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