Description

GHEXA-MNT-CON-EPO-010 Epoxy Resin Mounting Compound (2:1) is a high-performance, fast-curing epoxy embedding system engineered for precision cold mounting, sample encapsulation, and advanced metallographic preparation. Offering exceptional flowability, superior chemical resistance, strong adhesion, low shrinkage, and high optical transparency, this two-part epoxy ensures bubble-free penetration and accurate edge definition. With reliable curing in 30–60 minutes, it is ideal for laboratories requiring durable, dimensionally stable mounts for detailed grinding, polishing, and microscopic analysis.

Specifications

Ordering Information

Key Applications & Uses

• Metallographic cold mounting and embedding

• High-precision sample preparation for grinding and polishing

• PCB and electronic component encapsulation

• Semiconductor cross-sectioning and failure analysis

• Microstructure inspection and optical microscopy

• Research, QA/QC, and materials testing laboratories

• Pharmaceutical, biotech, academic, and industrial sample preparation workflows

Why Choose from G-Hexa?

• Premium Epoxy Quality – High clarity and low shrinkage for distortion-free mounts

• Superior Adhesion & Strength – Ensures secure encapsulation of delicate or irregular samples

• Consistent Laboratory Performance – Reliable curing and repeatable hardness across batches

• Fast & Efficient Workflow – Reduced curing time compared to conventional epoxies

• Technical Expertise – Professional guidance on mounting methods and consumable selection

• Trusted Scientific Supplier – G-Hexa supports researchers, universities, pharma, biotech, and industrial labs with dependable preparation solutions

Frequently Asked Questions (FAQs)

Q1: What is the recommended mixing ratio?
Mix Part A and Part B at a 2:1 weight ratio. Stir thoroughly for 4–8 minutes to ensure uniform curing.

Q2: How long does curing take?
At 25 °C, the system cures within 30–60 minutes, depending on sample size and ambient conditions.

Q3: Is this resin suitable for high-precision microscopy work?
Yes. Its high transparency and low shrinkage provide clear visibility and dimensional stability for detailed microstructural analysis.

Q4: Does it offer good edge retention during polishing?
Yes. The Shore D hardness of 82 and strong adhesion deliver enhanced edge protection and crisp boundaries.

Q5: Can it be used for electronic or PCB encapsulation?
Absolutely. Its excellent flowability and chemical resistance make it ideal for delicate electronic and semiconductor samples.

Q6: Who typically uses this epoxy mounting compound?
It is widely used in universities, research institutes, pharmaceutical labs, biotech facilities, and industrial quality control and failure analysis labs.