Diamond/CBN Ultra-Thin Precision Cut Off Wheels GHEXA-CUT-CON-DIA-001

Parameter Details
Types Available Electroplated Diamond (DP), Resin-Bonded Diamond (DR), Metal-Bonded Diamond (DM), CBN Boron Nitride (CBN-M)
Wheel Diameter Options 100 mm, 125 mm, 150 mm, 180 mm, 200 mm, 250 mm, 300 mm
Thickness Options 0.4 mm, 0.5 mm, 0.8 mm, 1.0 mm, 1.5 mm, 2.0 mm
Center Hole 12.7 mm (most sizes), 22.0 mm (select larger sizes), 32.0 mm (select larger sizes)
Bonding Types & Applications DP (Electroplated): Soft non-ferrous metals, PCB, plastics, fiber-reinforced resin – DR (Resin-Bonded): Hard/brittle materials like ceramics, composites, carbides, rare metals – DM (Metal-Bonded): Glass, ceramics, minerals, hard brittle materials – CBN-M: Hard steels, iron, Co-Ni alloys, lead-based alloys (low-speed sectioning)
Packaging 1 pc per order
Key Features Ultra-thin design for precision, high diamond/CBN concentration for longevity, low kerf loss, minimal heat distortion, compatible with low-speed precision cutters
  • Payment. Payment upon receipt of goods, Payment by card in the department, Google Pay, Online card, -5% discount in case of payment

  • Warranty. The Consumer Protection Act does not provide for the return of this product of proper quality.

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Description

Diamond/CBN ultra-thin precision cut off wheels GHEXA-CUT-CON-DIA-001 provide exceptional accuracy, minimal material loss, and superior surface finish for delicate and hard materials. Available in electroplated (DP), resin-bonded (DR), metal-bonded (DM), and CBN (CBN-M) variants, these wheels deliver long service life, reduced heat generation, and clean cuts ideal for low-speed precision sectioning. Perfect for quality control, failure analysis, microstructural preparation, and fundamental research in semiconductors, electronics, ceramics, alloys, glass, and more — compatible with low-speed precision cutting machines like the CT-150.

Specifications

Parameter Details
Types Available Electroplated Diamond (DP), Resin-Bonded Diamond (DR), Metal-Bonded Diamond (DM), CBN Boron Nitride (CBN-M)
Wheel Diameter Options 100 mm, 125 mm, 150 mm, 180 mm, 200 mm, 250 mm, 300 mm
Thickness Options 0.4 mm, 0.5 mm, 0.8 mm, 1.0 mm, 1.5 mm, 2.0 mm
Center Hole 12.7 mm (most sizes), 22.0 mm (select larger sizes), 32.0 mm (select larger sizes)
Bonding Types & Applications DP (Electroplated): Soft non-ferrous metals, PCB, plastics, fiber-reinforced resin – DR (Resin-Bonded): Hard/brittle materials like ceramics, composites, carbides, rare metals – DM (Metal-Bonded): Glass, ceramics, minerals, hard brittle materials – CBN-M: Hard steels, iron, Co-Ni alloys, lead-based alloys (low-speed sectioning)
Packaging 1 pc per order
Key Features Ultra-thin design for precision, high diamond/CBN concentration for longevity, low kerf loss, minimal heat distortion, compatible with low-speed precision cutters

Key Applications & Uses

  • Precision sectioning of semiconductors, integrated circuits, PCBs, and electronic components with minimal damage.
  • Cutting hard and brittle materials such as ceramics, glass, composites, carbides, and rare metals for microstructural analysis.
  • Preparation of samples in failure analysis, quality control, and R&D for alloys, metals, minerals, and advanced materials.
  • Low-speed cutting of hard steels, Co-Ni alloys, and lead-based alloys in metallurgy, automotive/EV, aerospace, and energy sectors.
  • Supporting teaching labs, university research, pharma/biotech sample prep, environmental testing, and industrial quality assurance workflows.

Why Choose from G-Hexa? G-Hexa stocks a comprehensive range of ultra-thin Diamond and CBN cut off wheels in multiple bond types and sizes, ensuring the perfect match for your precision cutting needs. Enjoy competitive pricing direct from reliable sources, fast delivery across India (including Nashik, Maharashtra), and expert advice on wheel selection for specific materials or machines like the CT-150. With high-quality abrasives offering extended life, clean cuts, and minimal waste, we help researchers, universities, labs, and industries achieve accurate, repeatable results. Plus, easy bundling with compatible blades, fixtures, and consumables for your complete metallographic setup.

Frequently Asked Questions (FAQs)

Q1: What is the main difference between electroplated (DP), resin-bonded (DR), and metal-bonded (DM) diamond wheels? A: Electroplated (DP) offers fast, aggressive cutting on softer materials like PCBs and plastics with a single diamond layer. Resin-bonded (DR) provides a balanced, versatile cut for hard/brittle materials with good self-dressing. Metal-bonded (DM) delivers maximum durability and longevity for tough applications like glass and ceramics.

Q2: When should I choose CBN-M wheels over diamond wheels? A: Use CBN-M for ferrous/hard steel materials (e.g., hardened steels, Co-Ni alloys) where diamond wheels may wear quickly; CBN excels in low-speed precision sectioning of iron-based alloys.

Q3: Are these wheels compatible with my low-speed precision cutting machine? A: Yes — all sizes fit standard Φ12.7 mm, 22 mm, or 32 mm arbors on machines like the CT-150, with ultra-thin design minimizing kerf and heat for clean metallographic cuts.

Q4: How do I select the right thickness and diameter? A: Choose thinner wheels (0.4-0.5 mm) for minimal material loss on delicate samples; larger diameters (200-300 mm) for bigger workpieces. Match to your sample size and machine capacity (up to Φ40 mm on CT-150).

Q5: Do these wheels require coolant or can they be used dry? A: Most perform best with coolant for heat reduction and longer life, especially on hard materials; dry cutting is possible for softer samples but may reduce wheel lifespan.

Q6: What is the typical service life compared to standard wheels? A: Ultra-thin high-precision design with premium diamond/CBN concentration offers significantly longer life (often 2-5x) than conventional wheels, reducing replacement frequency and downtime.

Q7: Are these wheels suitable for student/teaching labs? A: Absolutely — easy to install, low heat generation, and clean cuts make them ideal for educational setups, university practicals, and entry-level research without compromising precision.

Q8: Can I use different bond types on the same machine? A: Yes — switch bonds based on material (e.g., DP for PCBs, DR/DM for ceramics); quick arbor changes and compatibility ensure flexibility in multi-material labs.

Q9: What safety precautions should I follow? A: Always use proper guards, eye protection, secure clamping, and follow machine guidelines. Low-speed operation reduces risk, but ensure adequate ventilation or coolant for dust/heat control.

Q10: Does G-Hexa offer bulk discounts or custom sizes? A: Yes — contact us for volume pricing, custom specifications, or bundles with cutting machines/consumables. We support labs, institutions, and industries with tailored solutions across India.

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